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MG Chemicals 860-60G, Silicone Heat Transfer Compound, 25ml Jar, Case of 5
860 is a CPU heat sink compound. Our thermal paste designed to reduce thermal resistance between irregular metal surfaces. Coupled with reasonable thermal conductivity, 860 has a soft consistency and a wide operating temperature range, which in some instances makes it the best thermal paste for CPUapplications.
This silicone-based PC thermal paste is mostly used to improve heat flow between heat sinks and heat-generating components, such as CPUs, GPUs, LEDs, motors, and power components.
| Part # | Net Vol. | Net Wt. | Packaging |
| 860-60G | 25 mL | 60 g | Jar |
Ships within 48 hours · Estimated delivery Jun 21 - Jun 26
US$40
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